Electronics Adhesives Market reports and Global Analysis

 Electronics Adhesives Market reports and Global Analysis

Electronics Adhesives , Industry Analysis Report, Regional Outlook, Application Development, Growth Potential, Price Trends, Competitive Market Share & Forecast, 2025 ? 2035, Chem Reports

Global analysis of the Electronics Adhesives Market including market trends, applications, and growth forecasts.

Pages: 159

Format: PDF

Date: 11-2025

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Introduction 

The global Electronics Adhesives market is projected to grow steadily from USD XX million in 2025 to USD XX million by 2035, at an estimated CAGR of XX%. The base year for this study is 2024, with forecasts extending from 2025 to 2035. The primary objective of this report is to provide a thorough understanding of the market by examining its definition, segmentation, growth potential, emerging trends, and the challenges influencing industry progress. Extensive research and analysis were conducted to ensure the accuracy and reliability of the findings. All data and insights were collected from credible industry sources and validated by experts. Charts, graphs, and other visual tools have been integrated throughout the report to improve clarity and enhance the interpretation of market dynamics.

Market Segmentation

1. By Adhesive Type

a) Epoxy Adhesives

  • High-strength structural bonding
  • Encapsulation & potting compounds

b) Acrylic Adhesives

  • UV-curable acrylics
  • Structural acrylics

c) Silicone Adhesives

  • High flexibility
  • Thermal stability

d) Polyurethane Adhesives

  • Flexible bonding
  • Impact-resistant applications

e) Cyanoacrylate Adhesives

  • Fast bonding for small components

f) Conductive Adhesives

  • Electrically conductive
  • Thermally conductive adhesives

g) Other Electronics Adhesives

  • Polyimide-based adhesives
  • Phenolic resins
  • Hybrid formulations

2. By Form

  • Liquid Adhesives
  • Paste Adhesives
  • Film Adhesives
  • Hot-Melt Adhesives
  • B-Staged Adhesives

3. By Application

  • Surface Mount Technology (SMT)
  • Conformal Coating
  • Encapsulation & Potting
  • Underfill
  • Thermal Management
    • TIMs (Thermal Interface Materials)
  • Wire Bonding
  • Die Attach
  • Assembly of Connectors & Sensors
  • Display Assembly

4. By End-Use Industry

  • Consumer Electronics
  • Telecommunication Equipment
  • Automotive Electronics
  • Industrial Electronics
  • Medical Devices
  • Aerospace & Defense Electronics
  • Semiconductor Packaging
  • Renewable Energy (solar panels, inverters)

Key Players in the Global Electronics Adhesives Market

Leading Global Companies

  1. Henkel AG & Co. KGaA
  2. 3M Company
  3. H.B. Fuller Company
  4. BASF SE
  5. Dow Chemical Company
  6. Sika AG
  7. Evonik Industries AG
  8. LG Chem
  9. Avery Dennison Corporation
  10. LORD Corporation (Parker Hannifin)

Other Notable Players

  • Master Bond Inc.
  • DELO Industrial Adhesives
  • Shin-Etsu Chemical Co. Ltd.
  • Huntsman Corporation
  • Dymax Corporation
  • Bostik (Arkema)
  • Permabond Engineering Adhesives
  • AI Technology Inc.
  • Namics Corporation

Regional Analysis

1. North America

  • Strong demand from consumer electronics, EVs, aerospace electronics, and semiconductor packaging.
  • High adoption of advanced adhesives for thermal management and miniaturized devices.
  • Presence of major adhesive manufacturers and R&D hubs.

2. Europe

  • Strong market presence in automotive electronics, telecom, industrial automation, and renewable energy technologies.
  • Germany, France, Italy, and the UK lead consumption and innovation.
  • Emphasis on sustainable and low-VOC adhesive formulations.

3. Asia-Pacific

  • Fastest-growing region due to large-scale manufacturing of smartphones, computers, semiconductors, and automotive electronics.
  • China, South Korea, Japan, and Taiwan dominate production and consumption.
  • Increasing investment in 5G, IoT, EVs, and consumer electronics.

4. Latin America

  • Growing demand from telecom, automotive, and consumer electronics assembly markets.
  • Brazil and Mexico serve as manufacturing hubs.

5. Middle East & Africa

  • Emerging demand driven by telecom expansion, smart city initiatives, and industrial automation.
  • GCC countries and South Africa are major consumers.

Market Drivers

1. Rapid Growth of Consumer Electronics

The proliferation of smartphones, wearables, smart appliances, and portable devices is driving high demand for adhesives used in bonding, encapsulation, and component protection.

2. Expansion of Semiconductor & PCB Manufacturing

The miniaturization of components, advanced IC packaging, and increased chip complexity require high-performance adhesives with superior thermal and electrical properties.

3. Rising Adoption of Electric Vehicles (EVs)

EV batteries, power electronics, sensors, and charging components rely heavily on thermal interface adhesives and structural bonding solutions.

4. Increased Demand for Lightweight & Compact Electronics

Electronics adhesives replace screws and mechanical fasteners, enabling compact, lightweight device designs.

5. Growth of 5G and IoT Devices

High-frequency and sensitive electronics require specialized adhesives for heat management, bonding, and insulation.

6. Advancements in Adhesive Technology

Development of UV-curable, low-VOC, fast-curing, and high-temperature adhesives expands application possibilities.

Market Restraints

1. High Cost of Advanced Adhesive Formulations

High-performance adhesives required for semiconductors and EVs are expensive due to complex raw materials and engineering grade specifications.

2. Thermal & Mechanical Limitations

Some adhesives may fail under extreme temperatures, humidity, or vibration—critical for aerospace and automotive applications.

3. Strict Regulatory Compliance

Electronics adhesives must meet stringent environmental, chemical, and performance standards (RoHS, REACH), increasing cost and complexity.

4. Supply Chain Disruptions in Raw Materials

Shortages of silicones, epoxies, and specialty polymers can impact production and increase prices.

5. Competition from Alternative Bonding Technologies

Laser welding, mechanical fasteners, and soldering may replace adhesives in specific use cases.

SWOT Analysis — Electronics Adhesives Market

Strengths

  • High bonding strength with lightweight contribution
  • Excellent thermal management (especially TIM adhesives)
  • Compatibility with miniaturized and complex electronic architectures
  • Ability to replace mechanical fasteners to reduce assembly cost
  • Superior electrical insulation and protective capabilities

Weaknesses

  • High cost of advanced formulations
  • Sensitivity to environmental conditions (moisture, temperature)
  • Difficulties in rework or component replacement
  • Short shelf life for some adhesive chemistries
  • Need for precise application equipment and trained technicians

Opportunities

  • Expansion of EVs, autonomous vehicles, and power electronics
  • Growing demand for flexible electronics, OLED displays, and wearables
  • Increased investment in semiconductor packaging innovations
  • Rising need for adhesives in renewable energy (solar modules, battery systems)
  • Growth in medical electronics and miniaturized devices

Threats

  • Volatile raw material prices impacting adhesive formulations
  • Technological shifts toward non-adhesive bonding methods
  • Economic slowdowns affecting electronics manufacturing
  • Regulatory restrictions on chemical components used in adhesives
  • Increasing competition from low-cost regional manufacturers

Market Drivers

1. Rapid Growth of Consumer Electronics

The proliferation of smartphones, wearables, smart appliances, and portable devices is driving high demand for adhesives used in bonding, encapsulation, and component protection.

2. Expansion of Semiconductor & PCB Manufacturing

The miniaturization of components, advanced IC packaging, and increased chip complexity require high-performance adhesives with superior thermal and electrical properties.

3. Rising Adoption of Electric Vehicles (EVs)

EV batteries, power electronics, sensors, and charging components rely heavily on thermal interface adhesives and structural bonding solutions.

4. Increased Demand for Lightweight & Compact Electronics

Electronics adhesives replace screws and mechanical fasteners, enabling compact, lightweight device designs.

5. Growth of 5G and IoT Devices

High-frequency and sensitive electronics require specialized adhesives for heat management, bonding, and insulation.

6. Advancements in Adhesive Technology

Development of UV-curable, low-VOC, fast-curing, and high-temperature adhesives expands application possibilities.

Market Restraints

1. High Cost of Advanced Adhesive Formulations

High-performance adhesives required for semiconductors and EVs are expensive due to complex raw materials and engineering grade specifications.

2. Thermal & Mechanical Limitations

Some adhesives may fail under extreme temperatures, humidity, or vibration—critical for aerospace and automotive applications.

3. Strict Regulatory Compliance

Electronics adhesives must meet stringent environmental, chemical, and performance standards (RoHS, REACH), increasing cost and complexity.

4. Supply Chain Disruptions in Raw Materials

Shortages of silicones, epoxies, and specialty polymers can impact production and increase prices.

5. Competition from Alternative Bonding Technologies

Laser welding, mechanical fasteners, and soldering may replace adhesives in specific use cases.

SWOT Analysis — Electronics Adhesives Market

Strengths

  • High bonding strength with lightweight contribution
  • Excellent thermal management (especially TIM adhesives)
  • Compatibility with miniaturized and complex electronic architectures
  • Ability to replace mechanical fasteners to reduce assembly cost
  • Superior electrical insulation and protective capabilities

Weaknesses

  • High cost of advanced formulations
  • Sensitivity to environmental conditions (moisture, temperature)
  • Difficulties in rework or component replacement
  • Short shelf life for some adhesive chemistries
  • Need for precise application equipment and trained technicians

Opportunities

  • Expansion of EVs, autonomous vehicles, and power electronics
  • Growing demand for flexible electronics, OLED displays, and wearables
  • Increased investment in semiconductor packaging innovations
  • Rising need for adhesives in renewable energy (solar modules, battery systems)
  • Growth in medical electronics and miniaturized devices

Threats

  • Volatile raw material prices are impacting adhesive formulations
  • Technological shifts toward non-adhesive bonding methods
  • Economic slowdowns are affecting electronics manufacturing
  • Regulatory restrictions on chemical components used in adhesives
  • Increasing competition from low-cost regional manufacturers

Points Covered in The Report:
The points that are discussed within the report are the major market players that are involved in the market such as manufacturers, raw material suppliers, equipment suppliers, end users, traders, distributors and etc.
The complete profile of the companies is mentioned. And the capacity, production, price, revenue, cost, gross, gross margin, sales volume, sales revenue, consumption, growth rate, import, export, supply, future strategies, and the technological developments that they are making are also included within the report. The historical data from 2020 to 2024 and the forecast data from 2025 to 2035.
The growth factors of the market is discussed in detail, wherein the different end users of the market are explained in detail.
Data and information by manufacturer, by region, by type, by application and etc, and custom research can be added according to specific requirements.
The report contains the SWOT analysis of the market. Finally, the report contains the conclusion part where the opinions of the industrial experts are included.

Key Reasons to Purchase
To gain insightful analyses of the market and have a comprehensive understanding of the global market and its commercial landscape.
Assess the production processes, major issues, and solutions to mitigate the development risk.
To understand the most affecting driving and restraining forces in the market and its impact in the global market.
Learn about the market strategies that are being adopted by leading respective organizations.
To understand the future outlook and prospects for the market.
Besides the standard structure reports, we also provide custom research according to specific requirements.

Chapter 1 Industry Overview
1.1 Definition
1.2 Brief Introduction by Major Material Types
1.2.1 Epoxies
1.2.2 Polyurethanes
1.2.3 Silicones
1.2.4 Acrylics
1.2.5 Others
1.2.6
1.2.7
1.2.8
1.2.9
1.3 Brief Introduction by Major Product Types
1.3.1 Electrically Conductive
1.3.2 Thermally Conductive
1.3.3 Ultraviolet Curing
1.3.4 Others
1.3.5
1.3.6
1.3.7
1.3.8
1.3.9
1.4 Brief Introduction by Major Regions
1.4.1 United States
1.4.2 Europe
1.4.3 China
1.4.4 Japan
1.4.5 India
1.5 Brief Introduction by Major Application
1.5.1 Surface Mounting
1.5.2 Wire Tacking
1.5.3 Encapsulation
1.5.4 Conformal Coating
1.5.5
1.5.6
1.5.7
1.5.8
1.5.9
1.6 Brief Introduction by Major
1.6.1
1.6.2
1.6.3
1.6.4
1.6.5
1.6.6
1.6.7
1.6.8
1.6.9
1.7 Brief Introduction by Major
1.7.1
1.7.2
1.7.3
1.7.4
1.7.5
1.7.6
1.7.7
1.7.8
1.7.9
1.8 Brief Introduction by Major
1.8.1
1.8.2
1.8.3
1.8.4
1.8.5
1.8.6
1.8.7
1.8.8
1.8.9
Chapter 2 Production Market Analysis
2.1 Global Production Market Analysis
2.1.1  Global Capacity, Production, Capacity Utilization Rate, Ex-Factory Price, Revenue, Cost, Gross and Gross Margin Analysis
2.1.2  Major Manufacturers Performance and Market Share
2.2 Regional Production Market Analysis
2.2.1  Regional Market Performance and Market Share
2.2.2 United States Market
2.2.3 Europe Market
2.2.4 China Market
2.2.5 Japan Market
2.2.6 India Market
2.2.7  Market
Chapter 3 Sales Market Analysis
3.1 Global Sales Market Analysis
3.1.1  Global Sales Volume, Sales Price and Sales Revenue Analysis
3.1.2  Major Manufacturers Performance and Market Share
3.2 Regional Sales Market Analysis
3.2.1  Regional Market Performance and Market Share
3.2.2 United States Market
3.2.3 Europe Market
3.2.4 China Market
3.2.5 Japan Market
3.2.6 India Market
3.2.7  Market
Chapter 4 Consumption Market Analysis
4.1 Global Consumption Market Analysis
4.1.1  Global Consumption Volume Analysis
4.2 Regional Consumption Market Analysis
4.2.1  Regional Market Performance and Market Share
4.2.2 United States Market
4.2.3 Europe Market
4.2.4 China Market
4.2.5 Japan Market
4.2.6 India Market
4.2.7  Market
Chapter 5 Production, Sales and Consumption Market Comparison Analysis
5.1 Global Production, Sales and Consumption Market Comparison Analysis
5.2 Regional Production, Sales Volume and Consumption Volume Market Comparison Analysis
5.2.1 United States
5.2.2 Europe
5.2.3 China
5.2.4 Japan
5.2.5 India
5.2.6
Chapter 6 Major Manufacturers Production and Sales Market Comparison Analysis
6.1 Global Major Manufacturers Production and Sales Market Comparison Analysis
6.1.1  Global Major Manufacturers Production and Sales Market Comparison
6.2 Regional Major Manufacturers Production and Sales Market Comparison Analysis
6.2.1 United States
6.2.2 Europe
6.2.3 China
6.2.4 Japan
6.2.5 India
6.2.6
Chapter 7 Major Material Types Analysis
7.1  Major Material Types Market Share
7.2 Epoxies
7.3 Polyurethanes
7.4 Silicones
7.5 Acrylics
7.6 Others
7.7
7.8
7.9
7.10
Chapter 8 Major Product TypesAnalysis
8.1  Major Product Types Market Share
8.2 Electrically Conductive
8.2.1  Sales Analysis
8.3 Thermally Conductive
8.3.1  Sales Analysis
8.4 Ultraviolet Curing
8.4.1  Sales Analysis
8.5 Others
8.5.1  Sales Analysis
8.6
8.6.1  Sales Analysis
8.7
8.7.1  Sales Analysis
8.8
8.8.1  Sales Analysis
8.9
8.9.1  Sales Analysis
8.10
8.11.1  Sales Analysis
Chapter 9 Industry Chain Analysis
9.1 Up Stream Industries Analysis
9.1.1 Raw Material and Suppliers
9.1.2 Equipment and Suppliers
9.2 Manufacturing Analysis
9.2.1 Manufacturing Process
9.2.2 Manufacturing Cost Structure
9.2.3 Manufacturing Plants Distribution Analysis
9.3 Industry Chain Structure Analysis
Chapter 10 Global and Regional Market Forecast
10.1 Production Market Forecast
10.1.1 Global Market Forecast
10.1.2 Major Region Forecast
10.2 Sales Market Forecast
10.2.1 Global Market Forecast
10.2.2 Major Classification Forecast
10.3 Consumption Market Forecast
10.3.1 Global Market Forecast
10.3.2 Major Region Forecast
10.3.3 Major Application Forecast
Chapter 11 Major Manufacturers Analysis
11.1 3M
11.1.1 Company Introduction
11.1.2 Product Specification and Major Types Analysis
11.1.3  Production Market Performance
11.1.4  Sales Market Performance
11.1.5 Contact Information
11.2 Cyberbond
11.2.1 Company Introduction
11.2.2 Product Specification and Major Types Analysis
11.2.3  Production Market Performance
11.2.4  Sales Market Performance
11.2.5 Contact Information
11.3 Dow Chemical
11.3.1 Company Introduction
11.3.2 Product Specification and Major Types Analysis
11.3.3  Production Market Performance
11.3.4  Sales Market Performance
11.3.5 Contact Information
11.4 Dow Corning
11.4.1 Company Introduction
11.4.2 Product Specification and Major Types Analysis
11.4.3  Production Market Performance
11.4.4  Sales Market Performance
11.4.5 Contact Information
11.5 H.B. Fuller
11.5.1 Company Introduction
11.5.2 Product Specification and Major Types Analysis
11.5.3  Production Market Performance
11.5.4  Sales Market Performance
11.5.5 Contact Information
11.6 Henkel
11.6.1 Company Introduction
11.6.2 Product Specification and Major Types Analysis
11.6.3  Production Market Performance
11.6.4  Sales Market Performance
11.6.5 Contact Information
11.7 Hexion
11.7.1 Company Introduction
11.7.2 Product Specification and Major Types Analysis
11.7.3  Production Market Performance
11.7.4  Sales Market Performance
11.7.5 Contact Information
11.8 Huntsman
11.8.1 Company Introduction
11.8.2 Product Specification and Major Types Analysis
11.8.3  Production Market Performance
11.8.4  Sales Market Performance
11.8.5 Contact Information
11.9 ITW Performance Polymers
11.9.1 Company Introduction
11.9.2 Product Specification and Major Types Analysis
11.9.3  Production Market Performance
11.9.4  Sales Market Performance
11.9.5 Contact Information
11.10 Jowat
11.10.1 Company Introduction
11.10.2 Product Specification and Major Types Analysis
11.10.3  Production Market Performance
11.10.4  Sales Market Performance
11.10.5 Contact Information
11.11 LORD Corp
11.11.1 Company Introduction
11.11.2 Product Specification and Major Types Analysis
11.11.3  Production Market Performance
11.11.4  Sales Market Performance
11.11.5 Contact Information
11.12 Mactac
11.12.1 Company Introduction
11.12.2 Product Specification and Major Types Analysis
11.12.3  Production Market Performance
11.12.4  Sales Market Performance
11.12.5 Contact Information
11.13 Mapei
11.13.1 Company Introduction
11.13.2 Product Specification and Major Types Analysis
11.13.3  Production Market Performance
11.13.4  Sales Market Performance
11.13.5 Contact Information
11.14 DELO Industrial Adhesives
11.14.1 Company Introduction
11.14.2 Product Specification and Major Types Analysis
11.14.3  Production Market Performance
11.14.4  Sales Market Performance
11.14.5 Contact Information
11.15 Avery Dennison
11.15.1 Company Introduction
11.15.2 Product Specification and Major Types Analysis
11.15.3  Production Market Performance
11.15.4  Sales Market Performance
11.15.5 Contact Information
11.16 Benson Polymers
11.16.1 Company Introduction
11.16.2 Product Specification and Major Types Analysis
11.16.3  Production Market Performance
11.16.4  Sales Market Performance
11.16.5 Contact Information
11.17 BUHNEN (Germany)
11.17.1 Company Introduction
11.17.2 Product Specification and Major Types Analysis
11.17.3  Production Market Performance
11.17.4  Sales Market Performance
11.17.5 Contact Information
11.18 Master Bond
11.18.1 Company Introduction
11.18.2 Product Specification and Major Types Analysis
11.18.3  Production Market Performance
11.18.4  Sales Market Performance
11.18.5 Contact Information
11.19 Drytac
11.19.1 Company Introduction
11.19.2 Product Specification and Major Types Analysis
11.19.3  Production Market Performance
11.19.4  Sales Market Performance
11.19.5 Contact Information
11.20 Dymax
11.20.1 Company Introduction
11.20.2 Product Specification and Major Types Analysis
11.20.3  Production Market Performance
11.20.4  Sales Market Performance
11.20.5 Contact Information
11.21
Pidilite Industries
11.21.1 Company Introduction
11.21.2 Product Specification and Major Types Analysis
11.21.3  Production Market Performance
11.21.4  Sales Market Performance
11.21.5 Contact Information
11.22
Royal Adhesives and Sealants
11.22.1 Company Introduction
11.22.2 Product Specification and Major Types Analysis
11.22.3  Production Market Performance
11.22.4  Sales Market Performance
11.22.5 Contact Information
11.23
Sika AG
11.23.1 Company Introduction
11.23.2 Product Specification and Major Types Analysis
11.23.3  Production Market Performance
11.23.4  Sales Market Performance
11.23.5 Contact Information
11.24
Super Glue
11.24.1 Company Introduction
11.24.2 Product Specification and Major Types Analysis
11.24.3  Production Market Performance
11.24.4  Sales Market Performance
11.24.5 Contact Information
11.25

11.25.1 Company Introduction
11.25.2 Product Specification and Major Types Analysis
11.25.3  Production Market Performance
11.25.4  Sales Market Performance
11.25.5 Contact Information
11.26

11.26.1 Company Introduction
11.26.2 Product Specification and Major Types Analysis
11.26.3  Production Market Performance
11.26.4  Sales Market Performance
11.26.5 Contact Information
11.27

11.27.1 Company Introduction
11.27.2 Product Specification and Major Types Analysis
11.27.3  Production Market Performance
11.27.4  Sales Market Performance
11.27.5 Contact Information
11.28

11.28.1 Company Introduction
11.28.2 Product Specification and Major Types Analysis
11.28.3  Production Market Performance
11.28.4  Sales Market Performance
11.28.5 Contact Information
11.29

11.29.1 Company Introduction
11.29.2 Product Specification and Major Types Analysis
11.29.3  Production Market Performance
11.29.4  Sales Market Performance
11.29.5 Contact Information
11.30

11.30.1 Company Introduction
11.30.2 Product Specification and Major Types Analysis
11.30.3  Production Market Performance
11.30.4  Sales Market Performance
11.30.5 Contact Information
11.31

11.31.1 Company Introduction
11.31.2 Product Specification and Major Types Analysis
11.31.3  Production Market Performance
11.31.4  Sales Market Performance
11.31.5 Contact Information
11.32

11.32.1 Company Introduction
11.32.2 Product Specification and Major Types Analysis
11.32.3  Production Market Performance
11.32.4  Sales Market Performance
11.32.5 Contact Information
11.33

11.33.1 Company Introduction
11.33.2 Product Specification and Major Types Analysis
11.33.3  Production Market Performance
11.33.4  Sales Market Performance
11.33.5 Contact Information
11.34

11.34.1 Company Introduction
11.34.2 Product Specification and Major Types Analysis
11.34.3  Production Market Performance
11.34.4  Sales Market Performance
11.34.5 Contact Information
11.35

11.35.1 Company Introduction
11.35.2 Product Specification and Major Types Analysis
11.35.3  Production Market Performance
11.35.4  Sales Market Performance
11.35.5 Contact Information
11.36

11.36.1 Company Introduction
11.36.2 Product Specification and Major Types Analysis
11.36.3  Production Market Performance
11.36.4  Sales Market Performance
11.36.5 Contact Information
11.37

11.37.1 Company Introduction
11.37.2 Product Specification and Major Types Analysis
11.37.3  Production Market Performance
11.37.4  Sales Market Performance
11.37.5 Contact Information
11.38

11.38.1 Company Introduction
11.38.2 Product Specification and Major Types Analysis
11.38.3  Production Market Performance
11.38.4  Sales Market Performance
11.38.5 Contact Information
11.39

11.39.1 Company Introduction
11.39.2 Product Specification and Major Types Analysis
11.39.3  Production Market Performance
11.39.4  Sales Market Performance
11.39.5 Contact Information
11.40

11.40.1 Company Introduction
11.40.2 Product Specification and Major Types Analysis
11.40.3  Production Market Performance
11.40.4  Sales Market Performance
11.40.5 Contact Information
Chapter 12 New Project Investment Feasibility Analysis
12.1 New Project SWOT Analysis
12.2 New Project Investment Feasibility Analysis
Chapter 13 Conclusions
Chapter 14 Appendix
Author List
Disclosure Section
Research Methodology
Data Source
Interview List
Global Disclaimer

Market Segmentation

1. By Adhesive Type

a) Epoxy Adhesives

  • High-strength structural bonding
  • Encapsulation & potting compounds

b) Acrylic Adhesives

  • UV-curable acrylics
  • Structural acrylics

c) Silicone Adhesives

  • High flexibility
  • Thermal stability

d) Polyurethane Adhesives

  • Flexible bonding
  • Impact-resistant applications

e) Cyanoacrylate Adhesives

  • Fast bonding for small components

f) Conductive Adhesives

  • Electrically conductive
  • Thermally conductive adhesives

g) Other Electronics Adhesives

  • Polyimide-based adhesives
  • Phenolic resins
  • Hybrid formulations

2. By Form

  • Liquid Adhesives
  • Paste Adhesives
  • Film Adhesives
  • Hot-Melt Adhesives
  • B-Staged Adhesives

3. By Application

  • Surface Mount Technology (SMT)
  • Conformal Coating
  • Encapsulation & Potting
  • Underfill
  • Thermal Management
    • TIMs (Thermal Interface Materials)
  • Wire Bonding
  • Die Attach
  • Assembly of Connectors & Sensors
  • Display Assembly

4. By End-Use Industry

  • Consumer Electronics
  • Telecommunication Equipment
  • Automotive Electronics
  • Industrial Electronics
  • Medical Devices
  • Aerospace & Defense Electronics
  • Semiconductor Packaging
  • Renewable Energy (solar panels, inverters)

Key Players in the Global Electronics Adhesives Market

Leading Global Companies

  1. Henkel AG & Co. KGaA
  2. 3M Company
  3. H.B. Fuller Company
  4. BASF SE
  5. Dow Chemical Company
  6. Sika AG
  7. Evonik Industries AG
  8. LG Chem
  9. Avery Dennison Corporation
  10. LORD Corporation (Parker Hannifin)

Other Notable Players

  • Master Bond Inc.
  • DELO Industrial Adhesives
  • Shin-Etsu Chemical Co. Ltd.
  • Huntsman Corporation
  • Dymax Corporation
  • Bostik (Arkema)
  • Permabond Engineering Adhesives
  • AI Technology Inc.
  • Namics Corporation

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